Light module technology.sfp transceivers module

In the existing technology before December 2014, the typical printing circuit board includes substrates, transmitting end optical component interfaces, receiving end optical components interfaces, and electrical interfaces. Among them, the electrical interface further includes the transmitted data interface and the receiving end data interface. The transmitting end optical component interface of the printing circuit board and the receiving end optical module interface are arranged on a surface of the substrate. Among them, the transmitting end optical component interface is used to connect to the transmitted end optical component in the optical module, Connect to the receiving end optical component in the light module. In the existing technologies before December 2014, since the transmitting end optical component and the receiving end optical component in the light module adopt the left and right side -by -side layout in the X direction of the module structure, the transmitting end optical component interface and the receiving end optical component component The interface is arranged on the surface of the substrate according to the side side by side. The transmitting end data interface and receiving end data interface of the printing circuit board are also arranged on the surface of the substrate. Among them, the transmitted data interface and receiving end data interface is The provisions of CFP, CFP2, CFP4, etc.) are designed to be arranged separately on the substrate. Please refer to Figure 3, Figure 3 is the definition diagram of the electrical interface of the circuit board in QSFP+modules in the existing technology before December 2014. As shown in the figure, the electrical interface adopts the design form of a 38 contact. Among them, the transmitted end data interface in the electrical interface is arranged on the upper and lower surfaces of the substrate (below is called the first and second surfaces, respectively). The receiving terminal data interface is arranged on the upper and lower surfaces of the substrate, and the transmitted data interface and the receiving end data interface are arranged left and right on the substrate, that is, the part of the connection in the data interface of the transmitted end of the data interface is located on the first surface of the substrate and the remaining contacts Located on the second surface of the substrate, and the contacts on the first surface and the connection on the second surface are located on the left (or right side of the right) of the substrate. Some of the contacts in the receiving end data interface are located on the first surface of the substrate on the surface of the substrate. The remaining contacts are located on the second surface of the substrate, and the contacts on the first surface and the connection on the second surface are located on the right (or left) of the substrate. The transmitting end optical component interface of the printing circuit board and the transmitted data interface are connected to form the transmission path transmission path through the circuit board, and the receiving end optical component interface and the receiving end data interface form the receiver data transmission through the circuit board connection. path.